The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 08, 1998
Filed:
Oct. 09, 1996
Tsuyoshi Nakagawa, Hadano, JP;
Yasushi Neho, Ebina, JP;
Naoyuki Sakamoto, Yokohama, JP;
Shigeo Ohashi, Tsuchiura, JP;
Yoshito Ohmura, Owariasahi, JP;
Yukiko Iwama, Kokubunji, JP;
Tadakatsu Nakajima, Ibaraki-ken, JP;
Yoshihiro Kondo, Ibaraki-ken, JP;
Susumu Iwai, Hadano, JP;
Hitoshi Matsushima, Ryugasaki, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
A personal computer comprises a heat dissipation plate installed on a floor of its case, a motherboard disposed apart from the heat dissipation plate by a predetermined distance, and a daughter board disposed in such a manner that the motherboard is positioned between the heat dissipation plate and the daughter board. The daughter board is mounted with a central processing unit which generates heat. The motherboard is provided with a hole. A heat dissipation block extends from the heat dissipation plate through the hole in the motherboard, and is connected to the central processing unit through a heat conductive coupler. This forms a heat dissipation path which passes through the central processing unit, the heat dissipation block, the heat dissipation plate, and the case. In addition, another heat dissipation block is interposed between a keyboard and the daughter board so that another heat dissipation path can be formed through the central processing unit, another heat dissipation block, another heat dissipation plate, and the keyboard. A heat pipe may be connected to a heat dissipation plate.