The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 08, 1998

Filed:

May. 24, 1996
Applicant:
Inventors:

Shinichi Ogawa, Neyagawa, JP;

Hiroshi Nishimura, Neyagawa, JP;

Tatsuya Yamada, Moriguchi, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
257765 ; 257771 ;
Abstract

An aluminum interconnection of the invention contains scandium as an impurity, so that the hardness of the interconnection in improved. Moreover, after a thin Al-Sc alloy film is formed, an annealing is performed 80 as to make the crystal grain larger than the width of the interconnection. The resulting Al interconnection has a high resistance against a stressmigration or electromigration, when a current stress in applied at a practical temperature in an LSI. This greatly contributes to the fabrication of a semiconductor device having a fine structure.


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Ogawa, Shinichi. (1998). Aluminum scandium alloy interconnection (U.S. Patent No. 5804879). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5804879

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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