The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 08, 1998
Filed:
Dec. 10, 1996
Ralph Remsburg, Austin, TX (US);
Erica Scholder, Austin, TX (US);
Dell Computer Corporation, Round Rock, TX (US);
Abstract
A method and apparatus for simultaneously coupling a heat sink to an electrical device and reducing electromagnetic interference caused by the heat sink being coupled to the electrical device. A mother board, as used in an electronic circuit, is situated so that an electrical pad is located proximate to a socket for receiving the electrical device. The electrical device is placed inside the socket, and further has the heat sink thermally coupled to a top surface thereof. The heat sink serves to dissipate any heat radiating from the electrical device into a surrounding air mass. A heat sink clip physically and electrically engages with the heat sink and physically engages with the socket, thereby securing the heat sink to the device and the device to the socket. The heat sink clip also includes a tab that, when the clip is engaged with the heat sink, is in electrical contact with the pad, which in turn is in contact with a ground power supply. As a result, any electromagnetic interference ('EMI') radiation emitting from the electrical device is dissipated through the clip and into the pad, and from there to the ground power supply.