The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 08, 1998

Filed:

Jul. 12, 1996
Applicant:
Inventors:

Yoshiaki Yamada, Tokyo, JP;

Kiyonori Kajiyana, Tokyo, JP;

Assignee:

NEC Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
438643 ; 438653 ; 438906 ;
Abstract

Disclosed herein is a method of producing a semiconductor device which includes the steps of forming a hole in an insulating film covering a semiconductor substrate, forming a titanium nitride layer on surfaces of the hole and the insulating film, depositing tungsten on the titanium nitride layer with filling the hole to thereby form a blanket tungsten layer, etching back the blanket tungsten layer by a plasma gas including fluorine until the titanium nitride layer is exposed to thereby form a tungsten plug filling the hole, cleaning the titanium nitride layer to remove fluorine adhering to and remaining on the titanium nitride layer, and forming an aluminum layer on the cleaned titanium layer and the tungsten plug.


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