The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 08, 1998
Filed:
May. 26, 1995
Applicant:
Inventors:
Hiroshi Mori, Kanagawa, JP;
Toshiyuki Sameshima, Kanagawa, JP;
Assignee:
Sony Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
437 40 ; 437 41 ; 437238 ; 437978 ;
Abstract
An insulation film-forming method comprising the steps of:
Mori, Hiroshi. (1998). Insulation film-forming method for semiconductor device manufacturing (U.S. Patent No. 5804454). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5804454
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile