Semiconductor fabrication apparatus

Abstract

A semiconductor fabrication apparatus including a plurality of process units for sequentially processing a semiconductor wafer. A heating unit, a cooling unit, a resin coating unit, and a resin hardening unit are included. Also, a sender unit and a process control unit are included besides the process units. In the sender unit, a wafer size sensor is provided in order to detect the size of an original wafer. The wafer size data detected by the sensor is held and processed in the process control unit. Finding the original size of a wafer, the process control unit gives instructions to process units so as to set a correct stop position of the wafer and to select suitable wafer supporting means according to the detected wafer size. Thus, the apparatus is automatically set to a correct state for uniformly processing the semiconductor wafer. In some units, there are provided sensors to find the size of the supporting means, for example, carrier guides, forks, and stoppers. When the information from these sensors do not correspond to the wafer size detected by the wafer size sensor, the process control unit interrupts fabrication processes under execution and gives an alarm to operators.