The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 01, 1998
Filed:
Aug. 12, 1997
Masaki Kuribayashi, Sapporo, JP;
Kazuhiko Kobayashi, Sapporo, JP;
Shunichi Sato, Sapporo, JP;
Hironao Hakogi, Kawasaki, JP;
Fujitsu Limited, Kawasaki, JP;
Abstract
An optical semiconductor module including a housing (54), an optical semiconductor assembly (56), a movable ferrule (84), and a sleeve (60). The housing (54) has a hole (80) into which a connector ferrule (76) is inserted. The optical semiconductor assembly (56) is accommodated in the housing (54). An optical fiber (74,82) having a first end (82a) and a second end (82b) is fixed in the movable ferrule (84). The movable ferrule (84) has a thin hole (84a) in which the second end (82b) of the optical fiber (82) is inserted and fixed. The first end (82a) of the optical fiber (82) is supported so as to be optically coupled to the optical semiconductor assembly (36). The sleeve (60) is accommodated in the hole (80) of the housing (54), so as to align the movable ferrule (84) and the connector ferrule (76) with each other. The movable ferrule (84) is biased so as to be pressed against the connector ferrule (76) in the sleeve (60). With this configuration, even if an optical connector is repeatedly mounted/demounted with respect to the optical semiconductor module, a high efficiency of optical coupling between the optical connector and the optical semiconductor assembly (56) can be stably maintained, thus providing an optical semiconductor module having a high reliability.