The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 01, 1998
Filed:
Mar. 18, 1997
Arthur Edward Burns, II, Santa Cruz, CA (US);
Peter Michael Davis, Santa Cruz, CA (US);
Dean Albert Tarrant, Sand Jose, CA (US);
Seagate Technology, Inc., Scotts Valley, CA (US);
Abstract
A liquid dispense system for dispensing a 2-part epoxy resin compound to form bond beads having weights on the order of 1-20 mg. The dispensing system includes an epoxy resin compound pre-mixing and loading station, an epoxy dispense time and dispense force calibration station, and a plurality of epoxy dispensing third stations. Throughout the process, critical dispense related data is recorded on, and retrieved from, an on-board semiconductor memory device mounted on, and maintained with, the portable dispense syringe structure. Since the viscosity of the mixed epoxy compound is changing over time, any dispensing of constant amounts of the epoxy compound requires adjustments to dispense time and dispense force. These adjustments are made at a dispense station and are based on a calibration sample taken at the calibration station. The calibration step involves dispensing a sample of the loaded epoxy compound in the dispense syringe, and recording data on the memory device pertaining to the number of shots dispensed to produce the sample, the time taken for each shot and the total weight of the sample. At a dispensing station, a process controller reads the recorded data on the memory device and determines the count-down status of the worklife time, prior to dispensing any epoxy compound. On the basis of the data, the adjusted dispense time and dispense force parameters for dispensing a particular bead weight of the epoxy compound are determined in accordance with the ongoing change in viscosity of the curing epoxy resin compound.