The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 01, 1998
Filed:
Nov. 22, 1996
Applicant:
Inventors:
Jae-sung Lee, Suwon, KR;
Jin-pyo Lee, Suwon, KR;
Nam-cheol Kim, Suwon, KR;
Seong-won Lee, Suwon, KR;
Assignee:
Samsung Electronics Co., Ltd., Suwon, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B / ;
U.S. Cl.
CPC ...
428192 ; 428131 ; 428212 ; 428156 ;
Abstract
A semiconductor wafer label for identifying a wafer includes at least one concave mark formed on an edge of a flat zone of each wafer. The label may include one or more concave marks having a first width and first length and one or more concave marks having a second width and a second length. Accordingly, it is not necessary to take the wafer out of a wafer cassette in order to read the wafer number, thereby reducing contamination and damage to the wafer.
Lee, Jae-sung. (1998). Label for semiconductor wafer (U.S. Patent No. 5800906). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5800906
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile