The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 01, 1998
Filed:
Nov. 26, 1996
Katsuya Kosaki, Tokyo, JP;
Takeshi Kuragaki, Tokyo, JP;
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Abstract
An apparatus for adhering a wafer to a supporting substrate includes a chamber having a lower part including a wafer stage having a planar surface on which a wafer having a surface covered with an adhesive is mounted with the adhesive facing upward, an upper part for covering the planar surface of the wafer stage, an evacuation port for evacuating the chamber, and a pressure plate opposite a supporting substrate disposed on the wafer and movable downward so that the pressure plate presses the supporting substrate toward the wafer. At least three gauge blocks having a thickness larger than that of the wafer are disposed on the planar surface of the wafer stage, surrounding a wafer and sandwiched between the supporting substrate and the planar surface when the supporting substrate is pressed toward the wafer. Heaters for heating the wafer and the supporting substrate are embedded in the lower and upper parts of the chamber. A gap between the wafer and the supporting substrate and filled with the adhesive is uniform within the area of the wafer surface.