The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 01, 1998
Filed:
Nov. 15, 1996
Applicant:
Inventors:
Shoju Aoshima, Nagoya, JP;
Naokuni Muramatsu, Handa, JP;
Assignees:
Techno Coat Company, Ltd., , JP;
NGK Insulators, Ltd., , JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B28B / ;
U.S. Cl.
CPC ...
164271 ; 164138 ; 2491141 ;
Abstract
A mold for casting aluminum or aluminum alloy made of a copper alloy having a thermal conductivity of not less than 0.20 cal/s.cndot.cm.degree.C. The mold cavity surface is locally or entirely formed with a coated layer. The coated layer may be either (i) a cermet layer including of at least one element selected from the group consisting of Co, Cu, Cr and Ni, or (ii) a Co--, Ni--, Cr --or Mo-based hard alloy layer. The copper alloy mold exhibits distinguished thermal conductivity and resistance to melt damages.