The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 01, 1998
Filed:
May. 24, 1996
Applicant:
Inventor:
Kinuko Mishiro, Kawasaki, JP;
Assignee:
Fujitsu Limited, Kawasaki, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
29830 ; 29840 ; 1562733 ; 1562735 ; 1562755 ; 1562759 ;
Abstract
A method of manufacturing a connecting structure of first and second printed wiring boards each having an electrode for conductively connecting to each other using a conductive film. A first printed wiring board with a resist film bonds to a second printed wiring board directly or using conductive film or bonding film. Both electrodes can be bonded using a conductive film and/or a bonding film. The resist film on one printed wiring board can be bonded to the electrode of another printed wiring board using a conductive film, or both resist films can be bonded using a conductive film.