The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 25, 1998
Filed:
Sep. 28, 1995
Gabriel Bracha, Tel Aviv, IL;
Eytan Weissberger, Ramat Hasharon, IL;
Yehuda Volpert, Petah-tikva, IL;
Ilan Algor, Ganei-tikva, IL;
Motorola, Inc., Schaumburg, IL (US);
Abstract
A method for forming one or more redundant vias (38a-38x) around a critical via (36) involves providing an integrated circuit design file (12) containing several overlay layers. Critical vias in the file (12) are identified via a step (16). Several redundant vias are serially placed around and connected in parallel to the critical via (36), and design rules are checked for each redundant via by performing steps (24-30). Redundant vias which do not violate design rules (26) are kept in a separate redundant overlay layer and added to the design of the integrated circuit. The added redundant vias increase the yield of the integrated circuit by bolstering the integrity of critical via connections.