The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 18, 1998
Filed:
Nov. 21, 1996
Roman Katchmar, Ottawa, CA;
Northern Telecom Limited, Montreal, CA;
Abstract
Making an assembly of a printed circuit board structure and heat sink structure by locating a thermally conductive surface release agent upon a side of one of the structures and causing a flowable thermally conductive material to flow through a hole in the heat sink and lie between the release agent and the other structure. The thermally conductive material lies in heat conductive contact with the release agent and with the other structure and in alignment with an electronic component which is to be cooled upon the board. The release agent ensures easy release of the printed circuit board structure from the heat sink structure for disassembly purposes. An assembly of the two structures is also covered.