The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 11, 1998

Filed:

Sep. 20, 1996
Applicant:
Inventor:

Hyun Sang Hwang, Seoul, KR;

Assignee:

LG Semicon Co., Ltd., Chungcheongbuk-do, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
257316 ; 257322 ;
Abstract

A nonvolatile memory device includes a semiconductor substrate of a first conductivity type; a gate insulating film formed on the substrate; a floating gate having a first region and a second region, the first region lying flat over the gate insulating film and the second region being extended from a first end portion of the first region and perpendicular to the first region; a control gate extending parallel to the second region of the floating gate, lying over the second end portion of the first region of the floating gate and perpendicular to the first region; an inter-insulating layer disposed between the floating gate and the control gate; a first spacer formed at a side wall of the second region of the floating gate and a second spacer formed at a side wall defined by the floating gate and the control gate; a high density source region of a second conductivity type formed in the substrate, being disposed a thickness of the first spacer distant from the floating gate; a first high density drain region of the second conductivity type formed in the substrate, underlapping the floating gate; and a second high density drain region of the second conductivity type formed in the substrate, being disposed a thickness of the second spacer distant from the floating gate and adjacent to the first high density drain region.


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