The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 11, 1998
Filed:
Aug. 02, 1996
Applicant:
Inventor:
Yuji Kobayashi, Santa Clara, CA (US);
Assignee:
Shinkawa U.S.A. Incorporated, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
2281805 ; 228-45 ;
Abstract
So as to prevent improper wire feeding, a vibration applying device such as an electromagnetic means, etc., is provided which applies a vibration to a spool when the spool is rotated in order to feed out a wire from the spool.
Kobayashi, Yuji. (1998). Method and apparatus for wire bonding (U.S. Patent No. 5791550). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5791550
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile