The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 04, 1998
Filed:
Feb. 28, 1997
Applicant:
Inventor:
Chikara Yamashita, Tokyo, JP;
Assignee:
NEC Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
257787 ; 257706 ; 257707 ;
Abstract
In a method for manufacturing a heat radiating resin-molded semiconductor device, a protrusion is formed on a side peripheral surface of a semiconductor chip, and the semiconductor chip is sealed with resin, so that spreading of the resin toward a back surface of the semiconductor chip is prevented by the protrusion. Also, a heat radiator is mounted on a back surface of the semiconductor chip.