The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 04, 1998

Filed:

Dec. 28, 1995
Applicant:
Inventors:

Ivan Sanchez, San Antonio, TX (US);

Yu-Pin Han, Dallas, TX (US);

Miguel A Delgado, San Antonio, TX (US);

Ying-Tsong Loh, Saratoga, CA (US);

Assignee:

VLSI Technology, Inc., San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
257530 ; 437922 ; 4372 / ;
Abstract

An integrated circuit having a semiconductor substrate and an anti-fuse structure formed on the semiconductor substrate. The anti-fuse structure includes a metal-one layer and an anti-fuse layer disposed above the metal-one layer. The anti-fuse layer has a first resistance value when the anti-fuse structure is unprogrammed and a second resistance value lower than the first resistance value when the anti-fuse structure is programmed. There is further provided an etch stop layer disposed above the anti-fuse layer, and an inter-metal oxide layer disposed above the etch stop layer with the inter-metal oxide layer has a via formed therein. Additionally, there is further provided a metal-two layer disposed above the inter-metal oxide layer. In this structure, a portion of the metal-two layer is in electrical contact with the anti-fuse layer through the via in the inter-metal oxide layer.


Find Patent Forward Citations

Loading…