Wafer carrier

Abstract

A wafer container for transporting or holding wafers in a horizontal axially aligned arrangement has minimal four point regions of wafer support at the edge portion of the wafers. A preferred embodiment has a first container portion and a closeable door. The first container portion has a first molded portion of a static dissipative material having an upright door frame with integral planar top portion. An integral bottom base portion with an equipment interface also extends from the door frame. A second molded portion has a transparent shell which connects to the door frame, to the planar top portion, and to the bottom base portion. Separately molded wafer support columns connect to the top planar portion and to the bottom base portion and include vertically arranged shelves with upwardly facing projection providing minimal point or point region contact with the wafers. The shelves include wafer stops to interfere with forward or rearward movement of the wafers when supported by the projections and to prevent insertion beyond a seating position. A side handle engaging both the first molded portion and the second molded portion operates to secure the molded portions together. A robotic handle connects to the planar top portion. The robotic handle, the wafer shelves, the side handles, and the door frame have a conductive path to ground through the machine interface.