Method of producing coil devices

Abstract

A method for accurately and inexpensively producing a chip-type coil device comprises first forming an insulating plate. A plurality of parallel division grooves are then formed in a first direction on the insulating plate on one surface thereof. Thereafter, a conductive layer is formed on the insulating plate, wherein the conductive layer also coats the division grooves. The process then entails forming recess grooves between the division grooves on the insulating plate on which the conductive layer has been formed, and then dividing the insulating plate by forming slots within the division grooves, wherein the slots have widths which are smaller than widths of the division grooves. The method then entails dividing the insulating plate in a second direction to form a plurality of cores, wherein each of the cores comprise at least two leg portions having a first recess therebetween formed by one of the first recess grooves, and further including terminal electrodes on the leg portions formed by the conductive layer. Thereafter, for each of the cores, winding wire is wound around a winding section of the core and the wire is connected to terminal electrodes on the leg portions. The method provides devices which have improved accuracy and strength compared to the conventional devices produced by press molding.