The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 28, 1998

Filed:

Sep. 18, 1995
Applicant:
Inventors:

Paul Anthony Manfredi, Waterbury, VT (US);

Richard Alan Bartley, Newburgh, NY (US);

Raymond George Morris, Essex Junction, VT (US);

Timothy Scott Chamberlin, Fairfax, VT (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B / ;
U.S. Cl.
CPC ...
451288 ; 451 41 ; 451 56 ; 451443 ; 451444 ; 451446 ; 451285 ; 451286 ; 451287 ; 451289 ;
Abstract

An apparatus for and method of conditioning a polishing pad suitable for in-situ use, is described. The apparatus consists of a wedge-shaped conditioning plate whose width varies as a function of its length and whose exact geometry is a function of the radial effects of the polishing process effecting conditioning of the polishing pad. The conditioning plate rests on the polishing pad and is surrounded by a loose-fitting frame that holds the conditioning plate stationary with respect to the rotating polishing table, preventing lateral movement of the conditioning plate, but allowing the plate to move in the vertical direction so that it can rest flat on the polishing pad. The bottom face of the conditioning plate has a roughened surface that serves to abrade the polishing pad and conditions it to an extent determined ostensibly by the downward force of the conditioning plate on the polishing pad, the roughness of the bottom surface of the conditioning plate, and the time the conditioning plate is in contact with the polishing pad surface.


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