The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 21, 1998
Filed:
Apr. 03, 1997
Applicant:
Inventors:
Everett Joseph Canning, Trenton, NJ (US);
Donald W Finley, Fairless Hills, PA (US);
Charles K Hoppes, Whippany, NJ (US);
Michael Sheridan, Sandown, NH (US);
Assignee:
Lucent Technologies Inc., Murray Hill, NJ (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
438119 ; 438118 ;
Abstract
The specification describes an interconnection technique using compliant metal coated photodefined polymer bumps for mounting and interconnecting component assemblies on substrates such as glass, printed wiring boards, etc. The polymer chosen for the bump structure has a relatively low T.sub.g and the polymer bump is metallized in a way that substantially encapsulates the polymer.