The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 14, 1998
Filed:
Jul. 09, 1996
Applicant:
Inventor:
Nobuyuki Itoh, Tokyo, JP;
Assignee:
NEC Corporation, , JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
361790 ; 361735 ; 361792 ; 361777 ; 361803 ; 361783 ; 361772 ; 257697 ; 257704 ; 257693 ; 439 65 ; 439 75 ; 439 83 ; 174 526 ; 174 525 ; 174 5051 ; 437206 ; 437247 ; 437209 ; 437211 ; 437220 ; 437-8 ; 437215 ;
Abstract
A semiconductor package is described which is constructed from a rectangular tape film, a wiring pattern formed on the tape film constituted by wiring composed of a conductive material, a semiconductor chip electrically connected to one end of the wiring pattern, and holes formed on the other end of the wiring pattern for connection by insertion of lead-pins. A method is then described for stacking and mounting a plurality of semiconductor packages on a wiring substrate by first vertically positioning lead-pins on a wiring substrate and then passing these lead-pins through the holes in the semiconductor packages.