The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 14, 1998
Filed:
Oct. 24, 1995
Applicant:
Inventors:
Shigeki Kato, Saitama-ken, JP;
Hiroshi Uematsu, Saitama-ken, JP;
Ken-ichi Ogawa, Wako, JP;
Tatsuya Hattori, Saitama-ken, JP;
Assignee:
Honda Giken Kogyo Kabushiki Kaisha, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01P / ;
U.S. Cl.
CPC ...
333248 ; 26427211 ; 333-11 ; 333 242 ;
Abstract
Dielectric circuit components such as a dielectric strip, dielectric blocks and dielectric ring inserted between conductive plates are molded from a thermoplastic material. As the thermoplastic material, thermoplastic resin is used which has a dielectric constant not greater than 2.4. The dielectric circuit components may be injection-molded from an injection-moldable high polymer material which contains fluorine and has a melting point not greater than 300.degree. C.