Hybrid optical integration assembly using optical platform

Abstract

An optical assembly structure includes, a semiconductor element generating a large amount of heat and a high impedance optical element which are to be mounted, with low optical loss on the same semiconductor substrate which has an optical waveguide formed thereon.The element generating a large amount of heat is mounted on a terrace of the semiconductor substrate directly or through an insulating layer having a thickness of submicron order, while the high impedance element is mounted in a groove which is etched into the semiconductor substrate to such an extent that the optical axis of the high impedance element mates with the optical axis of the optical waveguide layer formed on a recess in the semiconductor substrate. The optical axes can be adjusted independently for the respective elements. Alternatively, with a potential on the semiconductor substrate set equal to a supply voltage or a ground potential, a crystal substrate for a forward biased heat generating element is given the polarity opposite to that of a crystal substrate for a reverse biased element which may imply a problem of stray capacitance.