The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 14, 1998
Filed:
Jun. 07, 1996
Alfred I Tsung Pan, Sunnyvale, CA (US);
Ross R Allen, Belmont, CA (US);
Eric G Hanson, Burlingame, CA (US);
Hewlett-Packard Company, Palo Alto, CA (US);
Abstract
A solder drop ejector is disclosed where a current through liquid solder in a channel flows in a direction opposite to the direction of current through a fixed conductor insulated from the channel. The magnetic fields generated repulse the solder toward an orifice to eject a droplet of solder. The dielectric layer separating the fixed conductor and the solder is formed of a film. The film may be made extremely thin, such as 0.1 microns, so that the necessary repulsion force generated by the oppositely flowing currents may be achieved with relatively low driving currents of 10-200 amperes. The thin dielectric film is not molded and is not required to provide mechanical support to a channel wall. Hence, the manufacturing of the resulting solder jet printhead is simplified and its reliability is improved.