The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 14, 1998
Filed:
Jul. 22, 1997
Applicant:
Inventor:
Hideaki Hayakawa, Kanagawa, JP;
Assignee:
Sony Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B / ;
U.S. Cl.
CPC ...
451 41 ; 451285 ; 451286 ; 451287 ; 451288 ; 451289 ;
Abstract
The method and apparatus of polishing and post-processing a substrate by which the particle level after planarization of a semiconductor device by polishing may be reduced. According to the present invention, the substrate of the semiconductor device to be processed is maintained in a wet state since directly after polishing until the end of post-processing.