The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 07, 1998
Filed:
Mar. 03, 1997
Leon Li-Heng Wu, Austin, TX (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
An improved package structure for integrated-circuit chips is disclosed. In accordance with a preferred embodiment of the present invention, the integrated-circuit packaged structure comprises a wiring substrate, an integrated-circuit chip, and a heat spreader. The integrated-circuit chip has a first surface and a second surface, wherein the first surface is electrically and mechanically connected to the wiring substrate via a first set of solder joints. The heat spreader is connected to the second surface of the integrated-circuit chip via a second set of solder joints. The heat spreader includes an adhesion-promotion layer on top of a silicon layer, such that heat generated from the integrated-circuit chip can be efficiently transmitted to and subsequently dissipated by the heat spreader.