The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 07, 1998
Filed:
Oct. 11, 1996
Applicant:
Inventors:
William Riis Hamburgen, Palo Alto, CA (US);
John Stuart Fitch, Newark, CA (US);
Yezdi Naval Dordi, Cambridge, MA (US);
Assignee:
Other;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
438122 ; 438121 ;
Abstract
Disclosed is a semiconductor package and method in which a semiconductor chip is mounted within the opening of a lead frame by bonding wires extending between the active front side of the chip and bonding pads of the lead frame, and the lead frame/chip assembly is encased within a plastic molded body, with the inactive back side of the chip exposed and facing outside the package.
Hamburgen, William. (1998). Paddleless molded plastic semiconductor chip package (U.S. Patent No. 5776800). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5776800
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile