The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 07, 1998
Filed:
Feb. 18, 1997
Klaus-Dieter Nittel, Frankfurt am Main, DE;
Karl-Heinz Nuss, Neu-Isenburg, DE;
Metallgesellschaft Aktiengesellschaft, Frankfurt am Main, DE;
Abstract
Disclosed is a process for the electroless deposition of a copper coating on an iron or iron alloy surface wherein the workpiece surface is contacted with a solution which contains hydrogen ions, 5 to 30 g/l Cu as well as 0.2 to 5 g/l Mg and preferably copper and magnesium with a weight ratio of Cu:Mg of (35 to 5):1 for a treatment time of 3 sec to 15 min at a temperature of the solution of 20.degree. to 65.degree. C. The invention also comprises a solid concentrate for preparing and replenishing the solution for carrying out the process, which consists of at least 85 wt-% CuSO.sub.4.5H.sub.2 O and MgSO.sub.4 (anhydrous) with a weight ratio of (35 to 5):1, and preferably contains in addition a maximum of 10 wt-% polyglycol and a maximum of 5 wt-% sodium chloride.