The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 30, 1998

Filed:

Jan. 03, 1997
Applicant:
Inventors:

Junichi Kobayashi, Ayase, JP;

Keiichi Murai, Yokohama, JP;

Shigeo Toganoh, Tokyo, JP;

Toshiaki Sasaki, Abiko, JP;

Hajime Yamamoto, Yokohama, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B41J / ;
U.S. Cl.
CPC ...
347 63 ;
Abstract

A method for manufacturing an ink jet head comprises a process to prepare a substrate where ink discharging energy generating elements are arranged; a process to provide a solid layer on the aforesaid substrate for the formation of liquid passages corresponding to the foregoing energy generating elements and at the same time, to provide a solid layer for the formation of a liquid chamber; a process to cover the substrate having the aforesaid solid layers with a resin; and a process to remove the aforesaid solid layers. The thickness of the aforesaid resin layer covering the upper part of at least a portion of the aforesaid solid layer for the formation of the ink passages on the side which is different from the side where the solid layer for the formation of a liquid chamber exists is made thinner than the thickness of the aforesaid resin layer covering the upper part of the solid layer for the formation of the liquid chamber, hence providing a highly reliable ink jet head having an excellent property suitable for cutting process required for obtaining the discharging port portion precisely and accurately as well as a secure adhesion between the resin and the substrate.


Find Patent Forward Citations

Loading…