The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 30, 1998
Filed:
Nov. 26, 1996
Applicant:
Inventor:
Eiji Kobayashi, Tokyo, JP;
Assignee:
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ; H05K / ;
U.S. Cl.
CPC ...
257783 ; 257712 ; 257713 ; 361702 ; 361704 ; 361707 ;
Abstract
A hybrid integrated circuit is provided with a radiator plate having a power device fixed at the surface through a spacer. As the spacer for preventing heat transfer from the radiator plate to the substrate, the solder layer has at least one supporting element selected from the group consisting of (1) globular metal grains of 80 to l200 .mu.m in diameter uniformly distributed therein, (2) a first solder layer of 50 to 200 .mu.m applied on the lower surface of the radiator, and (3) a dummy layer of 80 to 150 .mu.m high including at least one selected from the group consisting of a resistor layer, conductive layer and a glass layer on the radiator loading part.