The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 30, 1998
Filed:
Mar. 19, 1996
Applicant:
Inventors:
Assignee:
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C07F / ; C23C / ;
U.S. Cl.
CPC ...
556113 ; 556426 ; 556430 ; 427250 ; 430320 ; 430315 ;
Abstract
A layer forming material is a compound which has a structure of six-membered ring coordinated to Cu and containing Si, and of which general formula is represented by the following chemical formula: ##STR1## wherein X.sub.1 and X.sub.2 are elements of the VI group of the same or different types which are coordinate-bonded to Cu, and of which examples include O, S, Se, Te and the like, at least one of Y.sub.1, Y.sub.2 and Y.sub.3 is Si, L is a group which has a double or triple bond and which is able to supply electrons to Cu, and each of R.sub.1 and R.sub.2 is any of SiF.sub.3, SiH.sub.3, CF.sub.3 and CH.sub.3 for example.