The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 30, 1998

Filed:

Jun. 07, 1995
Applicant:
Inventors:

Jacquelyn A deGroot, Lake Jackson, TX (US);

Pradeep Jain, Lake Jackson, TX (US);

Lonnie G Hazlitt, Lake Jackson, TX (US);

Seema V Karande, Missouri City, TX (US);

Laura K Mergenhagen, Lake Jackson, TX (US);

Dan G Moldovan, Danbury, TX (US);

Kenneth B Stewart, Lake Jackson, TX (US);

Nicole F Whiteman, Lake Jackson, TX (US);

Assignee:

The Dow Chemical Company, Midland, MI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29D / ; C08L / ; C08L / ;
U.S. Cl.
CPC ...
428 357 ; 525240 ;
Abstract

The subject invention provides a polymer mixture having high heat resistivity, low hexane extractive and controllably lower or higher modulus. The mixture is comprised of at least one first substantially linear ethylene polymer, Component (A), and at least one second ethylene polymer which is a homogeneously branched polymer, heterogeneously branched linear polymer or a non-short chain branched linear polymer. When fabricated into film, the mixture is characterized by a heat seal initiation temperature which is substantially lower than its Vicat softening point as well as a high ultimate hot tack strength. When fabricated as a molded article, the mixture is characterized by high microwave warp distortion while maintaining a lower modulus. The polymer mixture is particularly well-suited for use in multilayer film structures as a sealant layer for such applications as cook-in packages, hot-fill packages, and barrier shrink films. In molding applications, the mixture is well-suited as freezer-to-microwave food storage containers and lids which maintain good flexibility at low temperature to allow easy openability of such containers.


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