The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 30, 1998
Filed:
Jul. 29, 1996
Masao Kamiguchi, Kawaguchiko-machi, JP;
Yuichi Hosoya, Kawaguchiko-machi, JP;
Koji Senda, Oshino-mura, JP;
Noriaki Neko, Fujiyoshida, JP;
Fanuc Ltd., Yamanashi, JP;
Abstract
A mold clamping control method capable of preventing any warp or strain on a molded product without stopping an injection pressure holding process so as to cancel the pressing force of an injection screw. In a series of injection and pressure holding processes, a movable platen is retracted from a mold clamping dwell position P2 to a mold opening dwell position P1, so that a substantial volume of a cavity of a mold is increased to temporarily lower the internal pressure of the cavity, thus making an internal stress of resin to be a product uniform to eliminate stress strains. In this method, an injection molding is performed to produce a precise product having no warp or strain even in molding a light guide plate which is subjected to molding abnormalities by the temporary stoppage of the injection pressure holding process according to the conventional method.