The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 23, 1998
Filed:
Nov. 09, 1995
Abstract
A photocurable and thermosetting coating composition which can be diluted with water is disclosed. This composition comprises a photopolymerizable resin having a number-average molecular weight in the range of from 500 to 50,000 and containing an aprotic ammonium salt-containing moiety in a proportion of from 0.2 to 4.0 mols per kilogram of the resin, a photopolymerization initiator, a thermosetting component, and a diluent. The photopolymerizable resin is obtained by the reaction of a polymer possessing a tertiary amino group with a monocarboxylic acid and a monoepoxy compound either or both thereof possessing a polymerizable unsaturated double bond. As the thermosetting component, at least one member selected from the group consisting of amino resins, cyclocarbonate compounds, blocked isocyanate compounds, and epoxy resins is used. A tack-free coating film is obtained by applying this composition to a printed circuit board and drying the applied layer of the composition. A delicate resist pattern can be formed by exposing the coating film to an actinic radiation and developing the unexposed areas of the coating film with water or a dilute aqueous acid solution. By thermally curing the patterned resist film, a solder resist film excelling in various properties expected of a solder resist is obtained.