The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 23, 1998
Filed:
Jun. 25, 1993
Applicant:
Inventors:
Takahisa Hara, Hyogo, JP;
Masahito Matsumoto, Osaka, JP;
Assignee:
Sumitomo Chemical Co., Ltd., Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C / ;
U.S. Cl.
CPC ...
264154 ; 264251 ; 264257 ; 264266 ; 264278 ;
Abstract
A method for manufacturing multi-layer molded-products, including the steps of supplying molten thermoplastic resin between an upper mold and a lower mold, and applying pressure to a forming cavity by clamping in a forming process. With this method, it is possible to easily produce a multi-layer molded-product wherein the covering material, such as a woven fabric, is entangledly fused to and integrally formed on the surface of a base plate with at least one hole that is made of thermoplastic resin.