The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 23, 1998
Filed:
Feb. 10, 1995
Applicant:
Inventors:
Dawn M Lee, Fremont, CA (US);
Subramanian Venkatkrishnan, Los Altos, CA (US);
Assignee:
Advanced Micro Devices, Inc., Sunnyvale, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B / ;
U.S. Cl.
CPC ...
451287 ; 451285 ; 451286 ; 451288 ; 451289 ; 451 41 ; 451 57 ; 451 66 ;
Abstract
Planarization of a patterned semiconductor wafer is effected by chemical-mechanical polishing using a carrier assembly comprising a carrier film adhesively bonded to a base plate, preferably by a pressure sensitive adhesive. Chemical-mechanical polishing is preferably conducted employing three phases of different pressures to prevent wafer slippage.
Lee, Dawn. (1998). Chemical-mechanical polishing of thin materials using non-baked carrier (U.S. Patent No. 5769696). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5769696
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile