The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 23, 1998
Filed:
Jun. 14, 1996
Clinton O Fruitman, Chandler, AZ (US);
Other;
Abstract
A non-cellular lapping pad is employed in a chemical mechanical planarization machine in conjunction with a polishing slurry to planarize the surface of a silicon workpiece. Planarization is effected by pressing the workpiece against the pad and moving the pad relative to the workpiece in at least one direction. The pad may be constructed of a porous material capable of adsorbing and entraining the slurry, such as fused polyethylene or non-cellular urethane. The pad may also be constructed may be made of a soft material to avoid damage to integrated circuit devices present on the surface of the silicon workpiece, such as a flexibilized epoxy. The slurry is a chemically and mechanically active solution comprising abrasive particles coupled with chemically reactive agents. The abrasive particles have a size of 10-200 nanometers, and suitable particle materials include colloidal silica, cerium oxide and alumina. The chemically reactive agents comprise 5-20% by weight of the solution, and suitable agents include hydroxides and potassium fluoride.