The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 16, 1998
Filed:
Jun. 19, 1996
Toshimichi Ouchi, Yokohama, JP;
Masanori Takahashi, Chigasaki, JP;
Canon Kabushiki Kaisha, Tokyo, JP;
Abstract
An electric circuit substrate having a multilayer structure is constituted from at least three wiring layers including an outermost wiring layer, at least one first inner wiring layer disposed under the outermost wiring layer, and a second inner wiring layer disposed under the at least one first inner wiring layer, each provided with a prescribed conductor pattern, respectively. In the multilayer structure, the outermost wiring layer has an alignment mark, the above-mentioned at least one first inner wiring layer has a blank portion free from its conductor pattern in a position immediately under the alignment mark, and the second inner wiring layer has an entire solid portion of its conductor pattern in a position immediately under the blank portion. The above multilayer structure including the alignment mark is effective in preventing recognition error or recognition failure of the alignment mark, thus allowing accurate positioning of the electric circuit substrate.