The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 16, 1998
Filed:
Apr. 17, 1996
Sukehisa Noda, Tokyo, JP;
Akira Fujita, Tokyo, JP;
Naoki Yoshimatsu, Fukuoka, JP;
Makoto Takehara, Fukuoka, JP;
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Abstract
A semiconductor device is disclosed which employs transfer molding to simplify a resin sealing step, reduces fabrication costs without using expensive elements, and has an improved efficiency of dissipation of heat generated by a power device and an improved product rating. The power device (101) and a control device (102) are placed in predetermined positions on horizontally positioned lead frames (103a, 103b), respectively. An insulating layer (105) of epoxy resin or the like is formed on a major surface of a heat sink (104), and a circuit pattern layer (106) formed on a major surface of the insulating layer (105) is shaped to conform to a predetermined circuit pattern. The lead frames (103a, 103b) are disposed on the circuit pattern layer (106).