The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 16, 1998
Filed:
Aug. 15, 1996
Toru Suda, Tokyo, JP;
Kabushiki Kaisha Toshiba, Kawasaki, JP;
Abstract
The semiconductor device according to the present invention can prevent the peeling-off of the chip from the die pad or the crack in the package by improving the efficiency of discharging of the moisture in the device even if the pitch of the inner leads is small, and can improve the reliability of the semiconductor device. The semiconductor device according to the present invention comprises a die pad holding a semiconductor chip, leads, bonding wires, and a plastic package containing the semiconductor chip, the die pad, a part of each of the leads, and the bonding wires. The bonding wires connected to the die pad extend to the outside of the plastic package.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile