The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 16, 1998

Filed:

Aug. 02, 1996
Applicant:
Inventors:

Yukinori Sumi, Kawasaki, JP;

Norio Fukasawa, Kawasaki, JP;

Assignee:

Fujitsu Limited, Kanagawa, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
257 48 ; 257690 ; 257738 ; 257778 ;
Abstract

A semiconductor device includes a semiconductor element; a wiring board including a base film on which a plurality of leads are provided; projecting electrodes, provided in an array, projecting from a lower surface of the wiring board; a plurality of leads, each of which has an inner lead portion connected to the semiconductor element and an outer lead portion connected to the projecting electrodes; a mounting hole provided in the base film for mounting the semiconductor element; and a supporting member supporting the wiring board and having a cavity for accommodating the semiconductor element in a position corresponding to the mounting hole. A pad portion for measurement is provided at a position spaced from the outer lead portion.


Find Patent Forward Citations

Sumi, Yukinori. (1998). Semiconductor device including pad portion for testing (U.S. Patent No. 5767528). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5767528

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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