The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 16, 1998
Filed:
Jul. 07, 1995
Applicant:
Inventor:
Masakazu Muroyama, Kanagawa, JP;
Assignee:
Sony Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
438693 ; 438633 ; 252 791 ; 106-3 ; 51308 ;
Abstract
In forming a wiring layer on a semiconductor stepped substrate (wafer) 15, the wiring layer is polished by using a slurry 12 which contains polishing particles treated in advance with a surface treatment agent containing at least an amino group. During polishing, a uniformity of polishing of the surface of the wafer 15 is maintained by rotating a wafer carrier rotation shaft 17 and a platen rotation shaft 14 while supplying slurry 12 through a guide tube 11. Consequently, scratches are prevented from being caused on surfaces of a multilayer wiring layer and an interlayer insulation film on a semiconductor device and, in addition, the wiring layer can be stably polished.