The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 16, 1998
Filed:
Nov. 14, 1996
Chingchi Yao, Saratoga, CA (US);
Ichiro Yamamoto, Sunnyvale, CA (US);
Shuji Nomura, Sunnyvale, CA (US);
Abstract
A method and resulting structure for fabricating interconnects through an integrated circuit. The method includes adding more power lines 80, 100, 151 and/or increasing the width of power lines 120 and/or adding a power bus 140 near regions of high current flow. The resulting structure also provides more metallization near regions of high current flow. Similar to the method, the resulting structure may include additional power lines 80, 100, 151 and/or wider power lines 120 and/or a power bus 140 to increase the amount of metallization. An improved routing technique is also provided. Such routing technique includes providing an initial Ucs value and then adding additional lines near high current regions to decrease the Ucs value.