The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 16, 1998
Filed:
Oct. 11, 1995
International Business Machines Corp., Armonk, NY (US);
Abstract
A method of forming a surface laminated circuit printed circuit board (SLC) where a photosensitive thermosetting resin in solution is applied atop a circuitized substrate. The method starts with the step of concentrating and solidifying the photosensitive thermosetting resin to build up a hardness therein high enough to withstand abrasion. This is done by first dissolving the photosensitive thermosetting resin in a solvent and then applying the solution to a substantially uneven surface. This is followed by evaporating solvent at a temperature below the curing temperature of the photosensitive thermosetting resin. Next, the surface of said resin layer is abraded to form a substantially even surface, and the resin layer is cured by heating the resin high enough to cross link and polymerize the resin.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile