The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 16, 1998
Filed:
May. 28, 1996
Toshiya Sadahisa, Koka-gun, JP;
Johji Nakamoto, Koka-gun, JP;
Kanji Nishijima, Ibaraki, JP;
Yoshinobu Kurosaki, Kobe, JP;
Nippon Paint Co., Ltd., Osaka-fu, JP;
International Business Machines Corporation, Armonk, NY (US);
Abstract
A method of metal-plating electrode portions of a printed-wiring board includes copper-plating the overall surface of the printed-wiring board on which an electric circuit has been formed, forming a metal plating resist coating on the copper plated wiring board except for on the electrode portions, and subjecting the electrode portions, which are not covered with the resist coating, to an electrolytic metal plating process, at least once, and then removing the remaining resist coating. The resist coating formation and the electrolytic metal plating process may optionally be repeated a predetermined number of times. An etching resist coating is then formed on the circuit portion including the electrode portions, and the copper-plated portion is then removed except from the circuit portion by etching and then stripping the etching resist coating.