The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 09, 1998
Filed:
Oct. 03, 1996
Takeshi Miyagi, Fujisawa, JP;
Yuji Iseki, Yokohama, JP;
Yasushi Shizuki, Yokohama, JP;
Kunio Yoshihara, Yokohama, JP;
Masayuki Saito, Yokohama, JP;
Kazuhito Higuchi, Yokohama, JP;
Takeshi Hanawa, Yokohama, JP;
Eiji Takagi, Yokosuka, JP;
Kabushiki Kaisha Toshiba, Kawasaki, JP;
Abstract
A wiring board for high-frequency signals, which comprises, a substrate, a dielectric layer formed on the substrate and provided on its surface with a U-shaped groove having an arcuate bottom for forming a wiring therein, and a signal wiring formed in the U-shaped groove, which is featured in that an upper end portion of the signal wiring is protruded out of the surface of the dielectric layer. A distance (H) from a protruded top surface of the signal wiring to a bottom of the U-shaped groove and a width (W) of the U-shaped groove preferably meet a relationship of 2<(W/H)<50, and the height of the portion of signal wiring which is protruded out of the surface of the dielectric layer is preferably in the range of 10 nm to 10 .mu.m.