The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 09, 1998

Filed:

Jan. 10, 1997
Applicant:
Inventors:

Eiichi Asada, Tokyo, JP;

Tetsuya Tanaka, Hamura, JP;

Assignee:

Shoei Chemical Inc., Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C03C / ; C03C / ;
U.S. Cl.
CPC ...
501 17 ; 501 18 ; 501 26 ; 501 77 ; 501 79 ;
Abstract

A lead-free insulating glass composition comprises (A) 50 to 85 wt. % of a glass comprising, on a weight basis, 28 to 38% of SiO.sub.2, 4 to 10% of B.sub.2 O.sub.3, 8 to 16% of Al.sub.2 O.sub.3, 15 to 23% of MgO, 1 to 12% of CaO, 3 to 9% of BaO, 8 to 16% of ZnO, and 3 to 8% of ZrO.sub.2 ; and (B) 50 to 15 wt. % of at least one filler selected from the group consisting of alumina and zircon. When using this glass composition as an insulating layer of a thick-film multilayer circuit board, there can be obtained a highly reliable thick-film multilayer circuit board in which the warpage of the substrate and leakage current are greatly reduced and the withstand voltage is highly improved.


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