The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 09, 1998
Filed:
Jun. 06, 1997
Applicant:
Inventors:
Kazutaka Shibata, Kyoto, JP;
Yutaka Murakami, Kyoto, JP;
Assignee:
Rohm Co., Ltd., Kyoto, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B / ; B32B / ; H01L / ;
U.S. Cl.
CPC ...
156235 ; 156344 ; 156584 ; 437266 ;
Abstract
A method of producing a semiconductor device wherein a metal preform layer is applied to an expand tape followed by a step of adhering a wafer to the metal preform layer using an adhesive layer of a thin adhesive sheet on the preform layer. The metal preform layer and the wafer are cut into chips wherein each chip has adhered to the bottom a cut piece of the metal preform layer. The expand tape is then expanded to separate adjacent chips from each other, and each chip is then removed from the expanded expand tape and then die-bonded to a lead frame.